APAC Wrap: 22 June 2026
SuperAI, Expert Interview Launch, Rigaku, PCB supply chain, Mediatek, NAND WFE.
Two weeks ago, some of the Funda team attended the Super AI conference in Singapore. Hats off to Peter Noszek and his team for pulling together great people for the conference, and we look forward to supporting them in any way we can for the 2027 edition in September next year.
Separately, Funda is ramping up its expert interview offering this month. A snapshot of some of the interviews published last week:
Led by the same analysts writing the reports, we are aiming to complete a hundred calls a month, summarised in a weekly update to clients.
The firm prides itself on the quality of the channel checks that feed into the reports as well as how quickly it responds to discourse dominating the AI trade (e.g. TurboQuant and InP export restrictions).
I’m particularly looking forward to being able to address more hot button topics by tapping on our growing expert network. For example, we could run a call on each of the topics discussed in the email below. Watch this space.
Please reach out to sales@funda.ai for more details.
Rigaku: 3,100 yen target from JPM
I believe the “Growing Demands” column describes an X-Ray application that Optical / CD cannot adequately perform.
PCB Supply Chain: Optical module upgrades benefit Compeq, ZDT and Unimicron (Commercial Times)
The increasing scale of AI clusters is driving demand for high-speed optical communications. With 800G optical modules entering mainstream deployment and 1.6T products being rapidly adopted, high-end PCB designs are moving towards higher layer counts, lower-loss materials, and mSAP (modified semi-additive process) manufacturing. Industry experts point out that the upgrade of optical modules not only boosts shipments but also raises the technical threshold and unit price of PCBs, benefiting supply chain companies such as Complux (2313), Zhen Ding-KY (4958), and Unimicron (3037).
Another bullish piece on Unimicron.
Kingboard:
