MLC NAND, X-Rays, and Vacuum Chambers
Lots of news for the APAC holdings yesterday so I thought to get this out asap.
Hat tip to Jukan who is the source for 3/4 of this update:
SLC and MLC price increases.
Applied–Besi hybrid bonding inline system already running at TSMC and being adopted by SK Hynix and Broadcom, and possibly Samsung.
Samsung evaluating new inspection equipment for hybrid bonding.
Metasurface results.
TrendForce March 2026 NAND Flash Contract Price Update
▶️ March Pricing Highlights
SLC: ASPs across all products rose in unison, each up more than 20% MoM
MLC: Supply exit and inventory depletion drove a +49.34% surge in 64Gb, hitting a new all-time high
Demand diversification (AI devices, robotics, industrial equipment, automotive) and extreme supply constraints are acting simultaneously